James "Jim" E. Kohl, CEO

James Kohl, Ph.D., has managed and contributed to successful technology development and commercialization efforts throughout his career.  Prior to founding EPIC Technologies, Dr. Kohl served as the CEO of Integrated System Assemblies Corp. (ISA). Prior to ISA, he was responsible for the management of all corporate-level research and development in electronic packaging at General Electric (GE), including early GE work in embedded die packaging.  Other relevant experience at GE included Venture Program Manager for an internal joint venture and Manager of the High Voltage Device and IC Branch.  Jim started his career at Bell Labs where he served as Technical Supervisor of the High Voltage IC Design Group.

Charles "Chuck" W. Eichelberger, VP Technology

A co-founder of EPIC, Charles Eichelberger has had a strong track record for invention and innovative Research and Development (R&D). He was named Coolidge Fellow at GE Corporate R&D where he worked for 22 years. He is named inventor on over 120 U.S. Patents, enabling business opportunities in electronic packaging, wireless cable systems, x-ray tomography, CID imaging, among many others.  Chuck is the first inventor named on early versions of embedded die packaging at GE and ISA as well as EPIC’s 5,841,193 U.S. patent.

S. Keith Phillips, VP Marketing and Sales

Prior to founding EPIC Technologies, Keith was President and founder of Nova Electronic Materials, Inc.   Previously, he was Sales Manager for Alcoa Electronic Packaging, where he managed 100% of corporate-wide sales of pin grid arrays (PGA’s) and multi-chip modules (MCM’s). Mr. Phillips was Asia Pacific Sales Manager for Cominco Electronic Materials. Prior to joining Cominco, he was Production Planner and Purchasing Agent at United Technologies Mostek.

John "JC" Currie, VP Finance

John is a graduate of Northeastern University.  John brings experience from working in the accounting and finance departments in the bio-tech and legal industries.